Kinetics of Dispersion During Annealing in Vacuum of Thin Double Nickel-Silver Films Deposited onto Oxide Materials
DOI:
https://doi.org/10.15330/pcss.20.2.175-180Keywords:
kinetics, dispersion, nickel-silver film, oxide materialsAbstract
The kinetics of dispersion of thin nickel-silver films deposited onto alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1000 °C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm nickel nanofilm deposited onto the oxide surface, and the second silver layer 1.5 mm thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during short-term heating up to 900 °C; and, after annealing at 950 °C and 1000 °C, they decompose immediately into individual droplets covering more than half the area of the ceramic substrates. The kinetic curves for the dispersion of these films were plotted.
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