Influence of vacuum annealing on the dispersion of thin double niobium-copper films deposited onto oxide materials

  • I. I. Gab Frantsevich Institute for Materials Science Problems of NAS of Ukraine
  • T. V. Stetsyuk Frantsevich Institute for Materials Science Problems of NAS of Ukraine
  • D. B. Shakhnin University "Ukraine"
Keywords: kinetics, dispersion, niobium-copper film, oxide materials

Abstract

The kinetics of dispersion of thin niobium-copper films deposited onto leucosapphire, alumina and zirconia ceramics and annealed in vacuum at temperatures up to 1100 °C with different exposition times at each temperature (from 5 up to 20 min) was studied. The double films consisted of two layers: the first metallization layer was 150 nm niobium nanofilm deposited onto the oxide surface, and the second copper layer 1,5 mm thick deposited over the first one as a solder was used for joining of metallized oxide samples. It was found that these films remain rather dense during heating up to 1050 °C; and after annealing at 1100 °C they decompose into individual fragments covering about 80% the area of the ceramic substrates even after annealing during 20 min. The kinetic curves for the dispersion of these films were plotted.

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Published
2020-06-15
How to Cite
Gab, I. I., Stetsyuk, T. V., & Shakhnin, D. B. (2020). Influence of vacuum annealing on the dispersion of thin double niobium-copper films deposited onto oxide materials. Physics and Chemistry of Solid State, 21(2), 332-337. https://doi.org/10.15330/pcss.21.2.332-337
Section
Scientific articles